The platform combines AI-driven analytics, improved imaging performance, and Industry 4.0 connectivity to address advanced PCB manufacturing requirements.
As electronic assemblies become more complex and densely populated, manufacturers are seeking faster and more accurate inspection technologies to maintain product quality and production efficiency. Addressing these demands, Test Research, Inc. (TRI) has introduced the TR7600 SV Series line-scan 3D Automated X-ray Inspection (AXI) system, designed to deliver up to 20% higher performance than the company’s previous TR7600 SIII platform.
The main features are:
- Up to 20% performance improvement over the previous generation
- Multi-resolution imaging from 7 µm to 25 µm
- Supports PCB sizes up to 1000 mm × 660 mm
- AI-based low-contrast defect recognition
- Compliance with IPC-CFX, SECS/GEM, SMEMA and Hermes standards
The Series targets high-volume electronics manufacturing environments requiring reliable inspection of challenging components and solder joints. Built on a high-speed inspection platform, the system accelerates image reconstruction and defect analysis while maintaining inspection accuracy across a wide range of applications, including ball grid arrays (BGAs), through-hole technology (THT) assemblies and system-in-package (SiP) devices.
A key feature is its multi-resolution imaging architecture, offering resolutions from 7 µm to 25 µm. This enables manufacturers to optimise inspection performance based on component size and production requirements while ensuring effective detection of hidden or difficult-to-identify defects. The platform is available in multiple configurations, with the TR7600 SV supporting PCB sizes up to 950 mm × 520 mm and the TR7600LL SV accommodating larger boards up to 1000 mm × 660 mm.
Artificial intelligence plays a significant role in enhancing inspection capability. Advanced AI algorithms improve the detection of low-contrast defects that may be difficult to identify using conventional inspection methods. Additional AI-powered functions, including AI Verify Host, AI Image Denoising and AI Fine Tuning, help streamline programming tasks, reduce setup time and improve inspection optimisation. These tools enable less-experienced operators to achieve inspection results comparable to those of senior engineers, helping manufacturers reduce downtime and improve productivity.
The system also supports seamless integration into smart factory environments. Compliance with Industry 4.0 communication standards, including IPC-CFX-2591, SECS/GEM, SMEMA, and IPC-HERMES-9852, enables the TR7600 SV Series to connect to manufacturing execution systems (MES) and facilitate data-driven production management.
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