HomeElectronics NewsHigh Temperature Thermistors For Automotive Systems

High Temperature Thermistors For Automotive Systems

As vehicle electronics run hotter than ever, new thermistors built for 175°C promise better heat sensing and control inside critical automotive systems.

The actual appearance of the product differs from the image.
TDK logo is not stamped on the actual product.
The actual appearance of the product differs from the image. TDK logo is not stamped on the actual product.

TDK Corporation has introduced a new NTC thermistor series that can operate at temperatures up to +175 °C, addressing rising heat levels inside modern automotive modules. The new NTCSP series is designed for conductive-glue mounting and supports temperature sensing and compensation across a wide range, from –55 °C to +175 °C.

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Automotive systems are using more powerful power semiconductors, which increases heat inside control units. As a result, nearby components must handle higher temperatures. Earlier NTC thermistors from TDK were rated up to +150 °C. The new series extends this limit by 25 degrees, allowing use in hotter environments without changing the sensing function.

The devices meet AEC-Q200 requirements, making them suitable for automotive applications. Typical use cases include temperature monitoring and compensation in systems such as ABS units, transmissions, and engine control modules. These systems often face both very low and very high temperatures, so stable operation across the full range is necessary.

A key change in the NTCSP series is the use of AgPd (silver-palladium) terminals. This structure supports conductive-glue mounting instead of conventional soldering. At higher temperatures, solder joints can face reliability issues. The AgPd terminal design helps maintain stable electrical and mechanical performance at +175 °C.

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The components are offered in a compact 1.6 × 0.8 mm package and are available in 10 kΩ and 100 kΩ resistance options. This allows designers to select values based on system requirements while keeping board space small.

The company plans to expand the lineup further, adding more chip sizes, resistance values, and operating temperature options to meet growing thermal demands in automotive and other high-temperature applications.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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