The first all-silicon, active micro-cooling fan—ultrathin, silent, and suitable for smartphones and AI applications.
xMEMS Labs, known for piezoMEMS technology and all-silicon micro speakers, have launched the xMEMS XMC-2400 µCooling chip. This is the first all-silicon, active micro-cooling fan tailored for ultra mobile devices and artificial intelligence (AI) applications.
This µCooling solution enables the integration of active cooling into the chips of smartphones, tablets, and other mobile devices. The chip, only 1-millimeter thick, operates silently and without vibration due to its solid-state design.
The chip is compact and lightweight, with dimensions of 9.26 x 7.6 x 1.08 millimeters and a weight under 150 milligrams, making it significantly smaller and lighter than traditional active-cooling alternatives. It can move 39 cubic centimeters of air per second. The chip’s silicon design ensures reliability, uniformity across components, durability, and an IP58 rating.
“Our revolutionary µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing,” said Joseph Jiang, xMEMS CEO and Co-Founder. “Thermal management in ultra mobile devices, which are beginning to run even more processor-intensive AI applications, is a massive challenge for manufacturers and consumers. Until XMC-2400, there’s been no active-cooling solution because the devices are so small and thin.”
“We brought MEMS micro speakers to the consumer electronics market and have shipped more than half a million speakers in the first 6 months of 2024,” Jiang continued. “With µCooling, we are changing people’s perception of thermal management. The XMC-2400 is designed to actively cool even the smallest handheld form factors, enabling the thinnest, most high-performance, AI-ready mobile devices. It’s hard to imagine tomorrow’s smartphones and other thin, performance-oriented devices without xMEMS µCooling technology.”
