HomePress ReleasesThermally-Enhanced And Fully Protected Miniature Buck Converter

Thermally-Enhanced And Fully Protected Miniature Buck Converter

The cost-effective buck converter has an integrated shielded inductor for low EMI and maintains high efficiency even at light load

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RECOM has added a 4A option to its RPX series of miniature buck converters. The RPX-4.0 is rated to 3.8 to 36V input and programmable 1 to 7V output at 4A. With a compact 5mm x 5.5mm footprint and low 4.1mm height in a thermally-enhanced QFN package, the buck module pushes the limit on power density. The product features on-off control, a power good signal and soft start, and is fully protected including under-voltage, short-circuit, over-current and over-temperature.

The RPX-4.0 efficiency is high, allowing full power operation up to 65°C and derated operation up to 90°C. Construction follows the RECOM ‘3D Power Packaging’ technology for high power density, with flip-chip on leadframe construction, an integrated shielded inductor for low EMI, and intelligent control of switching frequency to maintain high efficiency even at light load.

The RPX-4.0 needs just voltage setting resistors and input/output capacitors for a complete high-performance solution and is delivered with the RECOM 3-year warranty. An evaluation board, RPX-4.0-EVM-1, is also available, allowing customers to exercise all of the product features and optimise filtering to meet target system requirements.

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“We are excited to launch the latest in our RPX series of buck converters” commented Matthew Dauterive DC/DC Product Manager of RECOM, “Users will find it particularly suitable for industrial automation, test and measurement, portable devices, and high density or weight-sensitive applications”.


Vinay Prabhakar Minj
Vinay Prabhakar Minj
Vinay Prabhakar Minj is a technology writer and science communication specialist with a Master’s degree in Communication of Science and Innovation (Science Communication). He is a prolific contributor to Electronics For You, where he has authored over 1,000 articles covering electronics, semiconductors, embedded systems, IoT, and emerging technologies. With a strong foundation in science communication, Vinay focuses on translating complex engineering concepts into clear, accessible, and application-oriented content. His work spans topics such as sensor technologies, chip design, wireless systems, and next-generation electronics, making advanced innovations easier to understand for engineers, students, and industry professionals. Through his extensive contributions, he has built a reputation for delivering reliable, well-researched, and practical insights that help readers stay updated with the rapidly evolving electronics ecosystem. His writing bridges the gap between technical depth and real-world usability, supporting both learning and decision-making in the field.

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