Smart devices are getting complex. Imagine handling multiple protocols, interfaces, motor control and security all on a single chip. Read on!
We’re seeing a big challenge in smart devices today. Connectivity standards are evolving quickly and many products rely on multiple chips to handle different protocols. This makes upgrades, redesigns, and adding new features more complicated and costly.
To address this, Microchip Technology has introduced the PIC32-BZ6 MCU, a single-chip platform that combines multi-protocol wired and wireless connectivity in one device. With this MCU, designers can simplify complex designs while still supporting advanced features like touch interfaces, graphics, and motor control.
The device is built for demanding applications. It comes with 2 MB Flash and 512 KB RAM and offers flexible packages including 132-pin ICs and modules, with more options planned. It supports wireless protocols such as Bluetooth 6.0, Thread, Matter, and proprietary mesh networks and wired connectivity via CAN-FD, Ethernet, and USB 2.0.
The PIC32-BZ6 also includes 18 CVD touch channels, motor control peripherals like 12-bit ADCs, 7-bit DACs, analog comparators, PWMs, and QEI and security features such as immutable secure boot and hardware encryption engines for AES, SHA, ECC, and TRNG. It is AEC-Q100 Grade 1 qualified (125 °C) ensuring reliability in automotive and industrial environments.
This MCU shows how a single platform can handle multiple protocols, advanced interfaces, and security requirements, helping device makers keep up with evolving standards and market needs.
“The PIC32-BZ6 MCU stands out for its powerful blend of connectivity, integration and flexibility in a single-chip solution,” said Rishi Vasuki, vice president of Microchip’s wireless solutions business unit. “Few devices bring together this breadth of features in a single chip, and we’re already seeing strong tremendous early adopter activity. Customers are leveraging its multi-protocol wireless capabilities, advanced analog features and high I/O to develop smarter, more connected products with greater efficiency.”
