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Power Design For AI Servers

AI servers are running out of power and space. A small module can solve both, helping systems run better in tight designs. Find out more!

Microchip Unveils MCPF1525 Power Module: High-Efficiency 16V, 25A Buck Converter for Scalable Power Solutions
Microchip Unveils MCPF1525 Power Module: High-Efficiency 16V, 25A Buck Converter for Scalable Power Solutions

As AI and high-performance computing workloads grow, systems need power solutions that are efficient, reliable, and scalable. Integrated power modules simplify design, reduce energy use, and provide stable performance for modern data centers.

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Microchip Technology has launched the MCPF1525 Power Module, a highly integrated device with a 16V input buck converter that delivers 25A per module and can be stacked up to 200A. It supports programmable PMBus and I²C control, enabling higher power delivery within the same rack space. The module is designed to power next-generation PCIe® switches and high-performance compute MPUs used in AI systems.

The MCPF1525 uses a vertical package design to save board space, offering up to 40% area reduction compared to common solutions. Its compact size of 6.8 mm × 7.65 mm × 3.82 mm makes it suitable for space-limited AI servers.

For system reliability, the module includes diagnostic and protection features such as over-temperature, over-current, and over-voltage reporting through PMBus. It operates across a junction temperature range of –40°C to +125°C. An embedded EEPROM allows users to program default power-up settings.

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The MCPF1525 uses a custom integrated inductor to reduce conducted and radiated noise. This improves signal integrity, data accuracy, and reliability in high-speed computing, helping avoid repeated data transfers that waste system power and time.

“By leveraging Microchip’s comprehensive solutions including PCIe Switchtec technology, FPGAs, MPUs and Flashtec NVMe controllers, the MCPF1525 power module can help customers achieve the system efficiency, reliability and scalability required for high-performance data center and industrial computing applications,” said Rudy Jaramillo, vice president of Microchip’s analog power and interface division. “Seamless integration across Microchip’s portfolio simplifies development and lowers risk, helping designers accelerate time-to-market.”

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at EFY with a deep interest in embedded systems, development boards and IoT cloud solutions.

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