Pushing power limits in data centres? These modules enable smaller converters, less heat, and a shift from IGBT designs without a full redesign.
SemiQ Inc has introduced QSiC Dual3, a family of 1200 V half-bridge MOSFET modules built on silicon carbide (SiC). The modules are designed to replace IGBT modules with minimal design changes while improving efficiency, power density, and thermal performance in high-voltage systems.
This comes as AI data centres increase computing power and rack density. Air cooling is reaching its limits, and without a shift to liquid cooling, servers can overheat and shut down. In these systems, power conversion plays a key role. Engineers can use QSiC Dual3 modules in motor drives for liquid cooling systems, where dielectric fluids and coolants absorb and transfer heat. These fluids circulate through servers and move heat to chillers and cooling towers, helping maintain operation as power density increases.
Engineers working on motor drives, grid converters in energy storage systems, and industrial drives can use these modules to build smaller power converters with lower losses. By switching to SiC, they can reduce energy loss, reduce cooling needs, and improve system performance without redesigning the full system.
The QSiC Dual3 family supports power density up to 240 W/in³ in a 62 × 152 mm package. Some variants offer RDS(on) of 1 mΩ, which helps reduce conduction losses. Select versions also include an optional parallel Schottky barrier diode to reduce switching losses at high temperatures.
To improve reliability, the MOSFET dies undergo wafer-level gate-oxide burn-in above 1,450 V. The modules also have low junction-to-case thermal resistance, which helps reduce cooling needs and allows the use of smaller heatsinks.
“Rising AI-driven power and thermal demands in data centers are pushing the limits of traditional cooling and power systems,” said Dr. Timothy Han, President at SemiQ. “With a flexible design and industry-leading power density, the QSiC Dual3 series supports 250 kW liquid chiller applications on both active front ends and compressor drives, reducing size and weight compared to traditional silicon IGBT solutions while delivering the full efficiency of SiC.”
Click here for the original announcement.
