Large circuit boards used in data centres can now be checked for warpage, defects, and component issues during production.
SAKI Corporation has launched the 3Xi-ZS1EX automated X-ray inspection (AXI) system for inspecting XXL-sized printed circuit boards (PCBs) used in data centre applications. The system can inspect boards up to 1000 × 690 mm and is designed to handle issues such as PCB warpage, tall components, hidden defects, and production throughput.
The 3Xi-ZS1EX combines 3D X-ray imaging with SAKI’s artificial intelligence (AI)-based image analysis. It is built on the company’s high-rigidity platform and is designed to inspect large and complex electronic assemblies while keeping the machine footprint compact.
The system automatically corrects for PCB warpage, which can cause variations across the board surface and affect inspection accuracy. This allows inspection of XXL-sized PCBs while maintaining consistent results.
Its high-resolution 3D computed tomography (CT) inspection can capture tall components and internal structures that are difficult to inspect using conventional methods. This is particularly relevant for assemblies with high-profile components such as press-fit pins.
The system also uses a new AI-based algorithm for void detection. The algorithm helps reduce image noise and identify small voids and other hidden defects. Inspection parameters are automatically adjusted to support consistent inspection across different assemblies.
SAKI says the 3Xi-ZS1EX can achieve approximately 1.6 times higher takt time than its previous models. The system combines XXL-board inspection, 3D imaging, AI-based defect detection, and higher throughput in a compact platform for high-volume manufacturing.
Masaru Tamba, President and CEO of SAKI Corporation, commented: “With the rapid expansion of AI applications, the importance of data centres and related social infrastructure continues to grow. At the same time, printed circuit boards, particularly those for AI servers, are becoming larger and more sophisticated, creating new quality assurance challenges for manufacturers. The 3Xi-ZS1EX was developed to address these evolving requirements and support our customers in achieving stable, high-quality production. Through continued innovation in inspection technology, SAKI remains committed to contributing to the advancement of next-generation electronics manufacturing and the sustainable development of an AI-driven society.”
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