SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Compared to contact dispensing, jet dispensing can significantly improve production speeds by eliminating the need for Z-axis movement. Jet dispensing also makes it easier to deposit solder paste onto surfaces of varying heights.
PF606-P269J is halogen-free (ROL0) and complies with RoHS 2.0 and REACH. The new paste is formulated with the SAC305 Alloy and powder size ranges from type 4 to type 7 for fine dot jetting. It is suitable for fine pitch and ultra-fine pitch applications and devices with uneven, cavities and other difficult to print locations.
Dot volume, size and shape are easy to adjust and optimize for each individual component and pad on the board by using the jetting system, making it applicable for fine-pitch devices and also minimizing the failure rate in production.