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 MediaTek today launched its Dimensity 9000 5G smartphone chip for next-generation flagship smartphones, and announced device maker adoption and endorsements from some of the world’s biggest smartphone brands, including OPPO, vivo, Xiaomi and Honor. The first Dimensity 9000 powered flagship smartphones will...
Micron Technology, Inc. announced today that MediaTek Inc. has validated Micron’s low-power double data rate 5X (LPDDR5X) DRAM for MediaTek’s new Dimensity 9000 5G flagship chipset for smartphones. Micron is the first semiconductor company to sample and validate this...
It integrates powerful AI-engines, MEMC, VVC decoding and picture-in-picture technology to provide better display, audio and connectivity To power next-gen 8K TVs, the technologies in display, audio, AI, and broadcasting and connectivity of smart TVs should be cutting edge. Aiding this...
MediaTek today announced the new MediaTek Filogic 130 and Filogic 130A system-on-chips (SoCs) which both integrate a microprocessor (MCU), AI engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, and a power management unit (PMU) into a single chip. Filogic 130A also...
Job Description Responsible for customer issues support and lead technical discussions 1st or 2nd Issue narrow down and coordination for customer project issue (modem system/driver/interface) Bridge the technical gaps between teams in different locations Individual will be responsible for...
Gives brilliant imaging, smarter displays and boosted performance together for incredible mobile experiences Here's presenting the new Dimensity 920 and Dimensity 810 chipsets by MediaTek that give smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays...
The SoC equips personal computing devices with powerful performance and advanced 5G connectivity, multimedia and gaming technologies Building on its 6nm process technology, MediaTek has now launched the Kompanio 1300T, an SoC designed to provide incredible computing experiences with the...
Delivers reliable & crisp imaging, brilliant displays and 5G and Wi-Fi 6 connectivity to a broader consumer market MediaTek has launched the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset,...
It enables advanced camera capabilities, improved battery life, multiple voice assistant support and is highly power-efficient MediaTek has announced the launch of the Dimensity 700 5G smartphone chipset in India. The 7nm SoC is designed to bring advanced 5G...
With FR1+FR2 Dual Connectivity over 7Gbps downlink throughput is obtained, supporting faster communications Anritsu Corporation announces that its Radio Communication Test Station MT8000A has successfully achieved a downlink (DL) throughput over 7 Gbps using FR1+FR2 Dual Connectivity (DC) technology and...
 
 

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