Scope in Industry
3D integration is now considered to be a new paradigm for the semiconductor industry. There are various ways to vertically interconnect devices, with most advanced technology based on through-silicon vias (TSV). As expected, IBM, Samsung, Micron, TSMC, Hynix and STATS ChipPAC are the leading players concerning the number of patents held. On the other hand, relevant patents on 3D integration are also found among different academic institutions with ITRI being the top institute, followed by CEA (France) and Fraunhofer-Gesellschaft München (Germany). Apparently Europe is strong in intellectual properties for 3D ICs. World-wide, memory-enhanced applications are seen as the main driver for 3D Integration. With the maturity of heterogeneous 3D integration technologies and corresponding low-cost fabrication, a diversity of 3D integrated CMOS-MEMS products will be developed, leading to a further key application track .
3D System-In-Package Technology
Heterogeneous 3D SiP technology allows various components to be integrated alongside an FPGA into a single package to match system requirements, effectively providing robust solutions more quickly than in previous generations. This approach enables in-package integration of a range of components such as analogue, memory, ASIC, CPU, etc
The approach to heterogeneous 3D SiP integration is unique in the FPGA industry in that it uses a single monolithic FPGA core fabric (up to 5.5 million logic elements) and integrates multiple die around the FPGA. A monolithic FPGA core fabric provides maximum performance and utilization, and ensures that data can be processed at the highest rates possible without running into routing congestion, utilization bottlenecks, or degraded performance.
The technology that makes broad deployment possible is Intel’s patented, Embedded Multi-die Interconnect Bridge (EMIB). Intel designed EMIB for solutions that require advanced packaging and test capabilities. EMIB provides a simple integration flow and offers an ultra-high-density interconnect between heterogeneous die in the same package. It also enables in-package functionality that was either too complex or too cost prohibitive to implement with alternative in-package integration solutions.