Q. WHAT ARE THE LATEST IMPROVEMENTS TO SIGNAL PROCESSING, CIRCUIT TECHNOLOGY AS WELL AS MIXED SIGNAL IC DESIGN USED IN INTEGRATED SENSOR SYSTEM TECHNOLOGIES?
A. In addition, to 3D-Hall sensor technology ‘HallinOne’ mentioned earlier, there are further Improvements in increase of sensitivity and offset reduction. But the most important progress is that we are able to make the final test of the magnetic field sensors after fabrication without any external fields and therefore without a magnetic handler. This means precise 3D magnetic field sensors at a very low price.
Q. WHAT ARE THE MOST EXCITING PROJECTS CURRENTLY IN R&D AND EXPECTED IN THE NEXT FEW YEARS FROM THE SENSOR SYSTEMS RESEARCH AREA AT FRAUNHOFER INSTITUTE FOR INTEGRATED CIRCUITS?
A. In case of hall sensors we work on a 3D magnetic field camera which is fully calibrated. Calbration of the three magnetic field components Is state of the art but calibration of the orthogonality of these three components to each other is the challenge. Moreover, we work with s-net® SmartTracking on pioneering sensor networks technologies for Industrie 4.0 applications. In this way, we provide the basis for complete digitization of processes and value chains.