With lower power losses, higher thermal endurance, and simplified integration, the technology promises to cut system costs while boosting reliability across industries racing toward electrification and digital infrastructure.
The race for compact, efficient, and reliable power electronics is accelerating—and Microchip is responding with a new lineup of DualPack 3 (DP3) IGBT7 modules that aim to simplify design while scaling performance across high-growth sectors like motor drives, data centers, renewable energy, and electric mobility.
At the heart of the DP3 family is advanced IGBT7 technology, which delivers up to 15–20% lower switching and conduction losses compared to previous-generation IGBT4 devices. Designed for rugged environments, the modules can operate at junction temperatures up to 175°C under overload conditions, giving system designers more headroom for reliability and efficiency in power-intensive setups.
The key features are:
- Voltage classes: 1200V and 1700V
- Current ratings: 300A to 900A
- Phase-leg configuration
- Compact footprint: ~152 × 62 × 20 mm
- Higher power output without paralleling multiple modules
This translates into simplified layouts, reduced Bill of Materials (BOM), and lower system costs—critical factors as industries look to streamline converter designs. A key differentiator for DP3 is its positioning as a second-source option to industry-standard EconoDUAL™ packages. That flexibility not only strengthens supply chain resilience but also opens the door for design portability without extensive re-engineering. Beyond hardware, the modules integrate seamlessly with the company’s broader ecosystem of microcontrollers, security components, and connectivity solutions, offering developers a path to faster prototyping and shorter time-to-market.
Application spaces are diverse: from general-purpose industrial drives to renewables, energy storage systems, traction in e-mobility, and even agricultural vehicles. In all cases, the DP3 modules are engineered to address familiar design pain points such as dv/dt stress, higher conduction losses, and overload limitations. By combining high current ratings, reduced switching losses, and compact packaging, Microchip’s DualPack 3 IGBT7 modules bring a blend of performance and practicality tailored to the evolving demands of electrification and digital infrastructure.
