HomeElectronics NewsSiC Power Modules for AI Data Centre Transformers 

SiC Power Modules for AI Data Centre Transformers 

What if AI data centers could reduce power conversion losses and improve rack level efficiency using compact solid state transformer architectures?

Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centres
Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centres

Microchip Technology has launched 3.3 kV HV D3 mSiC power modules designed to accelerate the adoption of solid state transformers in AI hyperscale data centers and other high voltage power systems. The modules integrate 3.3 kV silicon carbide MOSFETs and Schottky diodes within an industry standard 62 mm package, enabling direct medium voltage power conversion closer to server infrastructure.

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The modules are designed for next generation AI facilities where increasing compute density is driving higher power demand and greater focus on conversion efficiency. Conventional low frequency transformer based architectures introduce additional conversion stages, bulkier infrastructure, and higher power losses. Solid state transformers aim to simplify this architecture by enabling more efficient medium voltage to DC power conversion with fewer stages.

Built using silicon carbide technology, the modules are engineered to support higher switching frequencies, improved thermal performance, and higher power density compared to conventional silicon based systems. A silicon nitride substrate improves thermal conductivity and power cycling capability, helping designers reduce cooling requirements while maintaining reliable operation under high load conditions.

The platform also supports 6 kV isolation, extended creepage distances, and CTI 600 rated materials for high voltage operation. According to the company, the higher voltage architecture can reduce the number of series connected devices by nearly half compared to lower voltage SiC alternatives when interfacing with 13.8 kV and 34.5 kV grid systems.

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Available in half bridge and common source configurations, the modules target applications in the 100 A to 300 A range and support both hard switched and soft switched topologies. Beyond AI data centers, the devices are also positioned for megawatt EV charging systems, rail transportation power supplies, industrial motor drives, and defense power infrastructure.

“As AI datacenters continue to push limits in supplying power from the grid to the GPU, the need for solid state transformers becomes increasingly important,” says Clayton Pillion, Vice President of Microchip’s High Power Solutions Business Unit. “Our 3.3 kV HV D3 mSiC power modules enable designers to reduce the number of series connected devices by roughly half versus lower voltage SiC alternatives.”

Click here for the official announcement.

Saba Aafreen
Saba Aafreen
Saba Aafreen is a Tech Journalist at EFY who blends on-ground industrial experience with a growing focus on AI-driven technologies in the evolving electronic industries.

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