HomeSpecialBluetooth LE Module Puts Antenna on Package

Bluetooth LE Module Puts Antenna on Package

A Bluetooth LE module supports Bluetooth 6, long-range communication, distance measurement, and multiple wireless protocols for IoT and industrial devices.

Ultra-compact Bluetooth Low Energy module, HY0025
Ultra-compact Bluetooth Low Energy module, HY0025

FDK Corporation has announced the development of the HY0025, an ultra-compact Bluetooth Low Energy (Bluetooth LE) module. It is the third product in FDK’s series of Bluetooth LE modules designed to occupy one of the smallest board areas in its class.

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The HY0025 uses SASP technology developed by Toshiba Corporation. The technology allows the antenna to be formed on the shielded package on the top surface of the module. This removes the need for a large keep-out area around the antenna, helping the module achieve one of the smallest board-level occupied areas in the world. The company says the module is suited for wirelessly transmitting data from a wide range of sensors used in physical AI and healthcare applications.

The HY0025 uses Nordic Semiconductor’s nRF54L15 SoC and complies with Bluetooth 6. Along with conventional Bluetooth LE communication, the module supports long-range communication through Coded PHY. It also supports Channel Sounding, which enables accurate distance measurement between devices. These capabilities can support applications that use location and distance information.

The module integrates an Arm Cortex-M33 processor operating at 128 MHz, along with 1.5 MB of NVM and 256 KB of RAM. These resources support applications that require wireless functions and security features.

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The HY0025 provides a maximum output power of +8 dBm and receiver sensitivity of -96 dBm. It can operate across a temperature range of -40°C to +105°C, allowing it to be used in harsh environments, including industrial and automotive applications.

Beyond Bluetooth LE, the module supports multiple wireless protocols, including Thread, Matter and Zigbee. This allows it to be used in different IoT applications and smart infrastructure systems.

With the HY0025, FDK aims to provide wireless connectivity for the growing requirements of IoT applications, where sensors, devices and systems need to exchange data wirelessly.

Click here for the original announcement.

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Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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