A new system supports medium-sized OLED panels with bonding accuracy and configurations for different manufacturing processes.
Panasonic Connect Group plans to launch the FPX107CG/FP driver mounting system for manufacturing medium-sized OLED panels. The system is designed to provide higher bonding accuracy and support different mounting processes and production line configurations.
The system supports panels from 7 to 26 inches and achieves main bonding accuracy of ±3 μm (3σ), with a Cpk of 1.33 for IC/TCP mounting. This improves on the existing FPX105CG, which is designed for LCD panels and provides ±5 μm (3σ) accuracy.
The FPX107CG/FP supports four mounting configurations: chip-on-glass (COG), film-on-glass (FOG), film-on-plastic (FOP), and chip-on-plastic (COP). Instead of combining ACF lamination, temporary bonding, and final bonding in one unit, the new system separates these processes into individual modules. This allows manufacturers to configure the equipment based on their required mounting process.
The system can also support both left-to-right and right-to-left material flow, allowing it to be used in different factory layouts, including paired production lines.
The new system is aimed at the growing use of OLED panels in medium-sized applications such as notebooks, tablets, and automotive displays. OLED adoption in these applications is increasing as manufacturers look for thinner designs and higher image quality.
OLED driver mounting can be more difficult than LCD mounting because the materials used in OLED panels have higher coefficients of thermal expansion. This can affect mounting accuracy, while manufacturers also need equipment that can handle different products and mounting configurations.
With higher bonding accuracy and a modular equipment design, the FPX107CG/FP is intended to give display manufacturers more flexibility when setting up production lines for medium-sized OLED panels.
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