Friday, December 5, 2025

SAP Launches Next Phase in Distributed Manufacturing Initiative

Announces Initial Co-Innovation Customers, Opens Registration for Joint SAP, UPS Early Adopters 3D Printing Program

sapLAS VEGAS — Sept. 20, 2016 — SAP SE today launched the next phase in its initiative to transform industrial 3D printing into a seamless distributed manufacturing process by opening up the program so other companies can benefit from a first-mover advantage. With a growing list of co-innovation customers, SAP and UPS (NYSE: UPS) launched a website today to expand the early phase of the program to a select number of co-innovation customers and partners worldwide to collaborate with SAP to test, validate and improve the model. This announcement was made at the SAP® Tech Ed conference taking place September 19–23 in Las Vegas.

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Growing List of Co-Innovation Customers Join Effort

SAP and UPS previously announced a distributed manufacturing collaboration to connect the manufacturing floor to the customer door. The collaboration integrates SAP solutions for the extended supply chain and Internet of Things with the UPS additive manufacturing and logistics network. Customers co-innovating in the early-stage production environment to streamline supply chains and get products to market faster and more cost-effectively as part of their digital strategies include Airbus AP Works, Fast Radius, HP Inc., Krones, Linear AMS, Moog Inc., Sealed Air Corporation and Stratasys.

“The successful transition of 3D printing from prototyping to manufacturing requires integration with business IT systems. HP understands the importance of end-to-end integration to maximize efficiency and technology adoption and is joining the SAP co-innovation program to help bring this to life,” said Scott Schiller, vice president, 3D market development, HP. “Powered by HP Multi Jet Fusion technology, HP delivers a manufacturing-ready solution for end-part production as well as an open software platform to connect to business IT systems. With leadership from SAP and collaboration with other innovators in the industry, 3D printing will more quickly move into mainstream manufacturing and streamline supply chains.”


 

Eben Efyian
Eben Efyian
Eben Efyian is a seasoned editor with over 16 years of experience in technology publishing, specializing in the electronics domain. As Editor at Electronics For You—India’s most respected publication for electronics professionals—he oversees the creation and curation of content for both Electronics For You magazine and ElectronicsForU.com. His deep understanding of the electronics industry, combined with a strong editorial skillset, allows him to bridge the gap between complex technologies and their real-world applications. Eben writes and edits content on embedded systems, IoT, semiconductors, electronic components, and industry innovations—helping engineers, students, and makers stay informed and inspired.

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