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Location: Bengaluru
Company: ARM
You will be involved with systems that incorporate Arm processors, focusing on aspects like chip packaging and System-on-Chip (SoC) integration. We develop physical hardware platforms used for software development and validation activities for both external partners/customers and our internal development teams. The team is working at the forefront of embedded compute, focusing on prototyping Arm’s latest IP products.
Responsibilities
Collaborate with engineering teams across multiple geographies to specify, evaluate, analyse and develop solutions for optimal PCB and silicon package integration. Focus on driving the PCB development alongside the chip packaging team, including brainstorming breakout and routing strategies, design rules and layer optimisation to ensure optimal performance, reliability, and cost-effectiveness. Provide timescale estimates and justifications to the program team.
Required Skills and Experience
- Strong understanding of electronics and embedded compute systems.
- Familiarity with different IC packaging technologies and their impact on PCB design to ensure seamless integration of SoCs, ensuring proper signal routing and power delivery.
- Experience of collaborating with chip packaging teams. Ability to influence and drive SoC device pin-outs for cost optimisation, routing feasibility and layer trade-off analysis.
- Detailed knowledge of high-speed design and interface standards (e.g. PCIe and DDR memory technologies). You’ll analyse and optimise signal paths to ensure signal quality, minimise noise, and prevent signal degradation, especially at high speeds.
- Expertise in escape routing analysis of high-density SoC’s and able to provide estimates of the IO count that can be routed with a particular stack-up and design rule set.
- Extensive knowledge of Signal and Power Integrity analysis techniques from both board design and chip packaging perspectives.
- Understanding of the PCB fabrication process (PTH and HDI), stackup/VIA topologies and substrate materials. Ability to collaborate with PCB fabricators and CEMs.
- Proficiency in the use of EDA tools, specifically Cadence Allegro PCB suite and OrCAD CIS.
- Good communication and interpersonal skills. Positive can-do attitude and attention to detail.
Desirable Skills And Qualities
The following skills are not essential, but experience in any of the following areas would enhance the application:
- Experience in using Signal Integrity tools from ANSYS, Siemens EDA etc.
- Experience of design automation and scripting.
- Enjoy collaborating and working in across geographies with multiple teams.
