As power densities rise in automotive and AI hardware, a solder-able sintering material that can target thermal conductivity and interconnect stability without pressure based processing.
YINCAE Advanced Materials has introduced TM230D, a 3 in 1 solder-able sintering material developed for advanced semiconductor packaging applications. As power densities increase across power modules, automotive electronics, and AI computing hardware, thermal management and interconnect durability remain central to device performance. Packaging materials are expected to dissipate heat efficiently while maintaining mechanical and electrical stability under sustained thermal stress.
The material is designed to support these requirements by combining high thermal conductivity with structural integrity after sintering. The resulting joint remains solid at temperatures up to 400 degrees Celsius, allowing use in demanding thermal environments without re melting. Its engineered interconnect structure is intended to minimise cracking phenomena associated with conventional silver Ag sintering materials, supporting longer operational stability in high power semiconductor assemblies.
From a manufacturing perspective, the material is designed to simplify process integration. It does not require applied pressure during sintering and is compatible with standard SAC solder reflow profiles. This enables incorporation into existing reflow lines without the need for specialised pressure equipment.
Lower processing temperatures and shorter cycle times form part of the specified workflow, allowing manufacturers to maintain streamlined production steps. By aligning sintering with conventional reflow practices, the material reduces additional handling complexity often associated with pressure based silver sintering solutions.
The material can deliver thermal conductivity of up to 110 W per metre Kelvin, supporting efficient heat transfer in high power devices. It is formulated as a 3 in 1, pressure free sintering solution suitable for semiconductor packaging applications.
After reflow based sintering, the formed joint remains stable at temperatures up to 400 degrees Celsius. The composition is engineered to reduce crack formation within the interconnect structure, addressing reliability concerns observed with traditional Ag based sintering materials.
