What happens when AI chips push semiconductor testing beyond conventional limits? These instruments can tackle rising demands for speed, connectivity, and power.
Teradyne has launched three instruments for its UltraFLEXplus automated test platform to address the growing test requirements of AI and data centre semiconductor devices.
The UltraPin5000-EM targets pattern-intensive AI and compute chips, offering up to 80 times more vector memory than competing offerings and pattern loading up to 10 times faster. Its Persistence Mode enables near-instant pattern reloads, while support for 5 Gbps data rates and independent clock frequencies per pin helps handle different device requirements. Real-time scan result compilation can also enable faster test decisions during structural testing.
For high-speed interfaces, the UltraPort-PCIe6 supports PCIe Gen6 testing at up to 64 Gbps using PAM-4 across 32 lanes per instrument. It combines per-pin parametric measurement capability with integrated loopback testing and a compute backend supporting up to 2 TB of memory. The instrument can perform both mission-mode testing and high-speed I/O scans, allowing some tests to move earlier in the manufacturing flow to improve Known Good Die confidence.
The UltraVS64-HP addresses the rising power requirements of high-performance compute devices. It can deliver up to 1,280 A per instrument and 5,120 A when supplies are ganged, with total test-cell capacity exceeding 15,000 A. Its 16 V range supports integrated voltage regulator architectures, while multi-point sensing and dynamic load response help maintain stable conditions during high-current testing.
“As the AI and data center market drives unprecedented growth in semiconductor complexity, Teradyne remains committed to delivering innovative solutions that enable our customers to stay ahead in this rapidly evolving market,” says Greg Smith, CEO of Teradyne. “This new suite of instruments expands the capabilities of our UltraFLEXplus platform, offering the industry’s most advanced, future-proof solutions for testing cutting-edge devices.”
For the official announcement, click here.
