New automotive-grade load switch combines ultra-low on-resistance, integrated protection, and compact packaging to improve power sequencing in next-generation vehicle electronics.
Diodes Incorporated has introduced a new automotive-compliant smart load switch to meet power rail control requirements in advanced vehicle electronics, including driver-assistance systems, infotainment units, and digital instrument clusters. Designed for efficient power sequencing and load management, the device combines low power loss, high current capability, and multiple integrated protection functions in a compact package.
The key features are:
- Ultra-low 8mΩ maximum RDS(ON) for reduced power loss
- Supports 0.8V to 4V input voltage range
- Delivers up to 6A continuous output current
- Integrated inrush current control and quick output discharge
- Built-in undervoltage lockout for stable system operation
The load switch supports an input voltage range from 0.8V to 4V, enabling deployment across a variety of low-voltage automotive power domains. Its ultra-low drain-source on-resistance of 8mΩ (maximum) helps minimize conduction losses while reducing heat generation, an increasingly important factor in densely packed automotive electronic systems.
Thermal performance is enhanced by a junction-to-case thermal resistance of 8°C/W, allowing the device to deliver up to 6A of continuous output current. Low quiescent current further improves energy efficiency during power-gating operations and helps reduce standby power consumption.
The device integrates several protection features that can eliminate the need for multiple discrete components. Controlled output voltage slew rate limits inrush current during startup, helping maintain system stability. An integrated quick-discharge function ensures downstream circuitry is fully discharged when power is removed, while undervoltage lockout prevents operation when supply voltages fall below safe levels.
By combining switching, sequencing, and protection functions in a single package, the solution can help automotive designers reduce PCB footprint, simplify power architecture, and shorten development cycles. The component is housed in a compact 3mm × 3mm V-DFN package and is also available in a version aimed at industrial and commercial applications.
Click here for the original announcement.
