A module helps add multimedia, AI, and connections to industrial systems. Can it also speed up development and integration? Find out!
Many industrial machines, medical devices, and edge computing systems need platforms that handle multimedia and AI tasks while staying compact and energy-efficient. Developers often struggle to find modules that combine processing power, connectivity, and multimedia functions in a standardized form.
The MSRZG3E system-in-package (SiP) from ARIES Embedded solves these problems. It is built on the Renesas RZ/G3E microprocessor, combining a quad-core Arm Cortex-A55, a Cortex-M33 real-time core, and an Ethos-U55 neural processing unit (NPU) in one chip. This setup delivers processing for applications that require both real-time control and AI data processing.
Designed in the OSM size M standard with 476 contact pads, the MSRZG3E exposes nearly all CPU functions, making integration into space-limited systems easier. It supports industrial interfaces allowing developers to connect sensors, actuators, and communication modules.
For systems with user interfaces, the module supports dual display outputs and camera inputs. It includes a video codec engine and hardware for frame processing, image scaling, color conversion, and video signal handling, enabling video rendering and multimedia handling without loading the CPU.
The company also provides an evaluation board to speed up development. It includes the MSRZG3E module and helps with prototyping and early system integration. The board supports real-time control tasks, offers a small design and multiple interface options, and reduces development time and cost for industrial and embedded systems that need multimedia processing and AI.
“With the RZ/G3E at its core, this SiP merges high-efficiency compute performance with a rich set of industrial interfaces optimized for demanding HMI applications,” stated Andreas Widder, Managing Director of ARIES Embedded. Packaged in the compact OSM (Open Standard Modules by SGET e. V.) size M form factor (30×45 mm²) with 476 contact pads, the module exposes nearly the entire CPU features, enabling seamless integration into industrial, medical, and edge computing systems.
Ivo Marocco, Vice President of Solutions of Renesas, added: “We greatly value our collaboration with ARIES Embedded as part of Renesas’ partner ecosystem. Their new MSRZG3E module, based on our recently launched RZ/G3E MPU, brings an innovative, high-value solution to our ecosystem—enabling faster development cycles and flexible customization for a wide range of embedded applications.”
