Devices are getting smaller, but they still need strong connections. These tiny antennas make Wi-Fi, UWB, and IoT devices work reliably in small spaces.
As devices get smaller and more connected, engineers face growing challenges in fitting high-performance antennas into ultra-compact electronics. Space constraints, interference from multiple radios, and the need for reliable connectivity across Wi-Fi, UWB, and ISM bands make designing next-generation IoT, consumer, industrial, and wearable devices increasingly difficult. Conventional antennas often struggle with efficiency, stable signal performance, and easy integration, slowing down development and increasing costs.
Taoglas’ new LTCC chip antennas aim to solve these issues by delivering strong performance in tiny packages with minimal keep-out areas. Built on low-temperature co-fired ceramic technology, these antennas offer high radiation efficiency, stable frequency response even in dense multi-radio designs, and compatibility with automated SMT pick-and-place assembly for high-volume production. They simplify integration, reduce design constraints, and allow engineers to maintain reliable connectivity in compact, space-limited devices.
The ILA.257 is suited for Wi-Fi 6/7 applications in ultra-compact devices such as wearables, portable electronics, and industrial IoT modules. Its small size and high performance allow engineers to maintain signal quality in limited space.
Specifications:
ILA.257 (Wi-Fi 6/7):
- Size: 3.2 × 1.6 × 0.5 mm
- Tri-band operation: 2.4 GHz, 5.8 GHz, 7.125 GHz (Wi-Fi 6E and emerging standards)
- High radiation efficiency
- Stable signal integrity across all bands
ILA.68 (UWB):
- Size: 3.2 × 1.6 × 1.1 mm
- Frequency range: 6 GHz to 8.5 GHz
- Stable omnidirectional radiation pattern
- Low insertion loss
ILA.89 (ISM 868/915 MHz):
- Size: 4.0 × 12.0 × 1.6 mm
- Frequency bands: 868 MHz (Europe), 915 MHz (US)
- Radiation efficiency: up to 47.9%
- Peak gain: 0.56 dBi
Together, these antennas help engineers address integration challenges in increasingly compact devices, providing reliable RF performance, mechanical robustness, and repeatable results in high-density electronic designs.
