What does a new smartphone processor reveal about Xiaomi’s chip ambitions? The Xring O3 advances its in-house silicon using a three-nanometre process.
Xiaomi has unveiled its Xring O3 smartphone processor, expanding its in-house chip development programme a year after introducing its first proprietary smartphone processor. The new chip is expected to power an upcoming foldable smartphone, according to sources cited by Reuters.
The processor is reportedly manufactured by TSMC using its three-nanometre process. The smaller process node allows more transistors to be integrated into a given area and can support improvements in processing capability and power efficiency.
The move gives the smartphone maker greater control over a key component of its devices and reduces reliance on external application processor suppliers. In-house silicon can also allow hardware and software to be developed together around specific device requirements.
The chip is reportedly intended for an upcoming foldable smartphone, making it one of the first applications for the company’s second-generation in-house mobile silicon. The launch follows the company’s introduction of its first proprietary mobile processor in 2025.
The use of TSMC’s three-nanometre manufacturing process could provide the transistor density and power-efficiency characteristics needed for advanced mobile workloads. However, detailed specifications of the Xring O3, including its CPU and GPU architecture, memory support, and AI-processing capabilities, have not been publicly disclosed.
The launch extends the company’s smartphone silicon programme from its first processor towards a second generation, with further details expected as the processor and associated device platform are formally introduced.
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