HomeElectronics NewsNew ProductsHighly-Reliable Connectors With FPC Assemblies For More Board Space

Highly-Reliable Connectors With FPC Assemblies For More Board Space

  • Allows PCBs to be stacked much closer together in tight design spaces
  • Highly resilient to demanding physical conditions

Connectors Datamate J-Tek and Gecko high-reliability (Hi-Rel) from Harwin come with flexible printed circuits (FPCs) attached for situations where there is little space above the board surface. Optimal for aerospace, motorsport, satellite and defence installations, these FPC assemblies provide engineers with lower profile interconnect solutions. This enables PCBs within a system design to be stacked much closer together. Through right-angled connections, these components can be kept at the periphery of the board resulting in thermal management and ease of mating benefits.

The Datamate J-Tek consists of a 2mm-pitch connector plus a 1A-rated 1mm-pitch FPC and is supplied in a single-ended design fitted with a male connector. The Gecko options have a 1.25mm-pitch connector along with a 0.4A-rated 0.5mm-pitch FPC, available in single- or double-ended configurations.

Durable interconnects

The FPCs feature a copper-clad polyimide base with a bonded overlay. A rigid area at each end facilitates connector mounting. They can support a much tighter bend radius than conventional cables and are also better suited to dynamic movement when bent. Thanks to the innovative 4-finger design used for the Beryllium Copper contacts, these assemblies exhibit strong resilience to shock (up to 100G) and vibrational forces (up to 20G), without breaks in the signal. Inclusion of stainless steel jackscrews on the Datamate connectors and sturdy latches on the Gecko connectors ensure interconnects are firmly secured. The Harwin FPC assemblies have an operational temperature range matching the relevant connectors, up to ‑65 degrees Celsius to +150 degrees Celsius. The free ends of the FPC are compatible with industry-standard FPC/FFC connectors that accept 0.3mm thickness circuits.


Vinay Prabhakar Minj
Vinay Prabhakar Minj
Vinay Prabhakar Minj is a technology writer and science communication specialist with a Master’s degree in Communication of Science and Innovation (Science Communication). He is a prolific contributor to Electronics For You, where he has authored over 1,000 articles covering electronics, semiconductors, embedded systems, IoT, and emerging technologies. With a strong foundation in science communication, Vinay focuses on translating complex engineering concepts into clear, accessible, and application-oriented content. His work spans topics such as sensor technologies, chip design, wireless systems, and next-generation electronics, making advanced innovations easier to understand for engineers, students, and industry professionals. Through his extensive contributions, he has built a reputation for delivering reliable, well-researched, and practical insights that help readers stay updated with the rapidly evolving electronics ecosystem. His writing bridges the gap between technical depth and real-world usability, supporting both learning and decision-making in the field.

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