KYZEN has announced the release of three cost-effective stencil cleaners, CYBERSOLV C8882, E5631 and E5631J. The E5631 and E5631J are capable of cleaning all types of solder paste flux from stencils and A-side misprints without damaging them. Moreover, the cleaners rinse easily without leaving a trace, therefore, reducing the dry time. CYBERSOLV is a solvent-based stencil cleaning fluid. All the cleaners can be used for hand-wipe and even in advanced cleaning processes such as automated under-stencil wipe processes, ultrasonic cleaning systems as well as spray systems designed for solvent.
As the components are getting smaller and the PCB assemblies are getting denser, the leftover solder deposits may affect the quality of the print leading to poor quality of small pads, causing poor solder joints. The solder paste builds up onto the aperture walls and bottom side of the stencil over time leading to insufficient or inconsistent transfer onto the pads. Therefore, cleaning the stencil is essential to remove traces of solder paste and achieve a good quality print.
According to the company, the E5631 and E5631J are cost-effective solutions that are capable of cleaning all types of raw solder paste flux from stencils and A-side misprints. The cleaners are formulated to be used in lower concentrations (<25 %). Moreover, the formula rinses easily and completely thus reducing typical dry time. It can be used at an ambient temperature in stencil cleaning processes which include spray-in-air, under-stencil and ultrasonic systems.
The solvent-based CYBERSOLV C8882 is a stencil cleaning fluid that is designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, misprinted PCBs, stencil tools and printing squeegees. Similar to the E5631-E5631J, the C8882 can also be used in automated under stencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems designed for solvent.