The tester helps check memory chips faster and better. It could be important for making AI and cloud devices work well at large scale.
Teradyne has launched the Magnum 7H, a new high-performance memory tester designed to meet the demands of high bandwidth memory (HBM) devices. Volume shipments are underway, and major HBM manufacturers have begun using it in production to scale up device output. The tester delivers high-speed, high-parallelism, and high-accuracy testing for stacked HBM dies, which are widely used in GPUs and AI accelerators.
The Magnum 7H supports a broad range of HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E. It provides full test coverage from base die wafer testing to memory core test and burn-in, ensuring consistent quality and reliability. The system supports testing at multiple manufacturing stages—both before and after singulation. Pre-singulated testing is done at the Known Good Stack Die (KGSD) or Chip on Wafer level using standard probers and probe cards. Post-singulated testing uses new bare die probers and handlers to further improve quality.
The tester offers a complete solution for stacked die that includes both logic base dies and DRAM dies. Memory testing is powered by a flexible algorithmic pattern generator (APG), while logic testing is enabled through the Logic Vector Memory (LVM) option. Fail List Streaming (FLS) captures errors in real time during both memory and logic tests. Fast DPS response time enhances device yield and overall quality.
Magnum 7H supports high-speed testing of current and next-generation HBM devices at up to 4.5 Gbps. It can be configured with up to 9,216 digital pins and 2,560 power pins, improving probe touchdown efficiency and increasing mass production throughput by 1.6x. These capabilities help reduce the total cost of testing in high-volume environments.
As demand for AI and cloud performance continues to grow, HBM adoption is accelerating. The Magnum 7H is built to support this growth by enabling scalable, accurate, and efficient testing throughout the full HBM manufacturing process.
