Power modules handle heat, moisture, and high voltage while making design easier and reducing failures. Learn more about these modules here.
Microchip Technology’s new BZPACK mSiC power modules focus on long-term reliability in harsh conditions while making system design and assembly easier. Built to meet HV-H3TRB standards, the modules are tested beyond 1000 hours, helping reduce failure risks in high humidity, high voltage and high temperature environments common in industrial and renewable systems.
The modules are available in half bridge, full bridge, three phase and PIM or CIB configurations. This gives designers flexibility to choose based on performance, cost and system layout.
To support stable operation, the modules use a CTI 600V case and maintain Rds(on) stability across temperature. They offer substrate options of Aluminum Oxide and Aluminum Nitride for insulation and heat management, supporting long-term use.
On the manufacturing side, the modules use a baseplate-less design with press-fit, solderless terminals. An option for pre-applied thermal interface material is also available. These features help reduce assembly time, improve consistency and support multi-sourcing through standard footprints. The modules are pin compatible, which simplifies replacement and design reuse.
Alongside these modules, Microchip Technology provides MB and MC families of mSiC MOSFETs for industrial and automotive use, including AEC-Q101 qualified options. These devices support common gate-source voltages of 15 V and above and are available in standard packages. Their HV-H3TRB capability helps limit moisture-related leakage and breakdown over time.
“The launch of our BZPACK mSiC power modules reinforces Microchip’s commitment to delivering rugged high‑performance solutions for the most demanding power‑conversion environments,” said Clayton Pillion, vice president of Microchip’s high-power solutions business unit. “By leveraging our advanced mSiC technology, we’re giving customers a simpler path to building efficient, long‑lasting systems across industrial and sustainability markets.”
Click here for the original announcement.
