A next-generation wave soldering system brings higher process control, programmable operation, larger PCB support, and remote monitoring to improve solder quality across electronics manufacturing, prototyping, research, and repair applications.
Electronics manufacturers seeking higher-quality solder joints and greater process consistency have a new option with the HAKKO FX-310 Wave Soldering Pot, introduced by American Hakko Products as the successor to the HAKKO 485 soldering system. Designed for electronics manufacturing, prototype development, research laboratories, repair, and production environments, the new system focuses on improving flexibility, automation, and operational control while accommodating increasingly complex PCB assemblies.
The key features are:
- Approximately 10kg solder capacity for extended operation.
- 1,050W total power consumption for industrial use.
- Includes integrated leak detection for enhanced operational safety.
- Ships with a foot switch, dross tray, and setup accessories as standard.
- Supports optional NP01 Series nozzles for wider application compatibility.
A major change in the FX-310 is its redesigned two-piece architecture, which separates the control module from the solder pot. This flat-top configuration creates more workspace for handling larger printed circuit boards while improving accessibility during soldering. The redesigned impeller also increases solder volume, allowing the system to support larger wave nozzles and a broader range of soldering applications using a single platform.
The system introduces NP01 Series nozzles featuring a bayonet-style connection for faster installation and replacement. The nozzle design also enables custom geometries that were previously difficult to manufacture, allowing users to tailor the soldering process for specialised assemblies and unique board layouts.
To improve solder quality, the FX-310 operates at temperatures up to 380°C and incorporates an enclosed solder pot that helps reduce oxidation. A built-in nitrogen input allows inerting of the solder pot, enabling cleaner solder joints and greater process stability in applications requiring tighter quality control.
The digital control unit features a large backlit display with an intuitive dial interface for adjusting temperature, solder flow rate, flow duration, and descent speed. Users can store up to five programmable process presets, enabling repeatable production when switching between different products. Additional features such as runtime monitoring, user lockout functions, Ethernet connectivity, and compatibility with HAKKO Control Software support remote monitoring, preventive maintenance, and production management.
