With 20nm we improved power efficiency, developed heterogenous multi-core SoCs and 3D-ICs got wide memory: Xilinx

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Q. What are the market needs that you are addressing with this 2nd generation?
A. If you look at our FPGAs, we can enable multiple 100 Gbps wired networks now. The advantage we are providing is that we are increasing ports per board and ports per dollar. So, you get more ports for the same dollar spent. This is the result of us giving the customers more integration, more density, more transceiver bandwidth and more memory. If you look at the radio base stations, we are now able to offer multi channel wireless radios. There, the challenge is to provide more performance at lower power levels.

For our SoC products, we serve a wide variety of applications spanning across medical, industrial, machine-vision, military and so on. All that we are trying to do is image processing and analytics. So, you get an image, you process it and you also do analytics on it. Take surveillance, for example. It not only involves taking pictures but also needs expert analysis. So, those are the main applications which will be simplified by the SoCs. Also, any data center or cloud based services where you need secure processing in the data lines can utilise this SoC for their purposes.

3D-ICs are family in the telecom space. They will go up to 100-400 Gbps smart networks and will allow us to work on next generation protocols like the SERDES Framer Interface Level-5 protocol which needs 40 Gbps.


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