Dual-sensor design combines radiometric thermal, 5MP visible, and on-board ISP to speed OEM integration across industrial and mobile platforms.
A new compact camera module debuted that merges thermal and visible imaging in a footprint designed for space- and power-limited devices. The launch marks the introduction of Lepton XDS, developed by Teledyne FLIR OEM, aimed at accelerating integration for embedded, industrial, and mobile OEM applications.
The module pairs a 160 × 120 radiometric Lepton 3.5 micro-thermal sensor with a five-megapixel visible camera. Its defining feature is the integration of patented MSX (Multi-Spectral Dynamic Imaging) technology, which overlays edge detail from the visible sensor directly onto the thermal image in real time. The result is sharper scene definition and improved contextual awareness—capabilities typically associated with higher-resolution, more expensive systems.
The key features are:
- 160 × 120 radiometric thermal sensor + 5MP visible camera
- Real-time MSX edge enhancement
- Integrated Prism ISP with thermal-visible fusion
- Radiometric JPEG (RJPEG) output with measurement tools
- SWaP-optimized, USB interface, ITAR-free classification
Unlike standalone thermal cores, the module incorporates the company’s Prism image signal processor, enabling on-board image enhancement and thermal-visible fusion without the need for heavy host-side processing. This reduces development complexity and shortens time-to-market for OEMs building fire detection systems, EV battery monitoring platforms, robotics, unmanned systems, smart infrastructure, and safety solutions.
The module is optimized for size, weight, and power (SWaP), making it suitable for battery-powered and always-on devices. An industry-standard USB interface further simplifies hardware integration. It is also ITAR-free and classified under 6A993.b.4.b, broadening its availability for commercial deployment worldwide.
Beyond fusion imaging, the system supports radiometric JPEG (RJPEG) output, enabling temperature data to be embedded directly within captured images. Built-in tools such as spot temperature measurement, regions of interest (ROI), isotherms, and customizable color palettes provide ready-to-use analytics out of the box. Compatibility with the broader FLIR OEM software ecosystem supports post-processing and reporting workflows.
With more than six million Lepton cores shipped to date, the company is positioning this new module as a scalable building block for high-volume production programs seeking enhanced thermal intelligence in compact form factors.
