The 3D SEMI CT AXI system is designed for efficient and precise defect detection, making it suitable for semiconductor and advanced packaging industries.
Test Research, Inc. (TRI) have introduced the TR7600 SIII Plus, a high-throughput 3D SEMI CT AXI system tailored for high-reliability sectors such as the semiconductor and advanced packaging industries.
The High Speed 3D SEMI AXI is engineered to cater to the high throughput requirements of OSATs, making it a key asset in the production environment. It incorporates AI-Powered Inspection algorithms that ensure precise defect detection, optimizing the quality control process.
This system offers a versatile inspection capability, handling C4 bumps ranging from 70 µm to 140 µm and Cu Pillars. Its flexible multi-resolution platform supports 2 – 20 µm production, allowing for inline fine-tuning without disrupting ongoing operations. Additionally, it can inspect large boards measuring up to 800 mm x 350 mm and weighing up to 12 kg.
Designed to integrate seamlessly with Smart Factory setups, it is equipped with MES connectivity, enhancing its utility in advanced manufacturing environments. The system is particularly well-suited for applications in advanced packaging, automotive, aerospace, and medical industries, where precision and reliability are paramount.
Some of the key specifications of the TR7600 SIII Plus, a high-throughput 3D SEMI CT AXI system include:
- Camera: Ultra-High Speed Line-Scan CCD Cameras
- X-ray Source: 60 – 110 kV
- Imaging Resolution: 2 μm – 20 μm
- Inspection Method: 2D, 2.5D, 3D Slicing, Planar CT (Optional)
- Max. PCB Size: 2 μm – 3 μm: 245 x 100 mm and 7 μm – 20 μm: 800 x 350 mm
- PCB Thickness: 0.6 – 7 mm (Optional: 0.4 mm, Max. PCB Weight: 3 kg)
- Max. PCB Weight: 12 kg
The TR7600 SIII Plus integrates with Smart Factory production lines and Manufacturing Execution Systems (MES), ensuring thorough inspection traceability. This system is compatible with current Smart Factory standards, including IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).
