As validation cycles tighten, engineers are revisiting how warpage and stress are simulated across complex assemblies and real production geometries.
Vinci has announced the availability of a thermo mechanical simulation capability designed to predict warpage in hardware designs, referring to how components bend, twist and deform under real world thermal conditions. The release marks the company’s second core physics capability and builds on its existing thermal simulation platform.
The functionality enables stress and warpage analysis directly from full resolution design files. It operates using a single pre-trained physics foundation model that runs behind the customer firewall and does not require tuning on proprietary data or changes to established workflows. Model preparation, meshing and convergence are handled within an automated process.
The announcement comes as hardware systems grow increasingly complex and tightly coupled across materials and scales. In such environments, physical validation has become a critical step in determining how quickly products can move from design to manufacturing. The capability is intended to support reasoning across full system assemblies without reducing designs to simplified blocks or averaged material approximations, linking local material behaviour with system level deformation in a repeatable workflow.
In a representative production benchmark shared by the company, the system automatically ingested full resolution layout files of approximately 1 GB and completed thermo mechanical warpage and stress analysis end to end in about 30 minutes. The benchmark included 100 by 100 cm boards with fine scale features down to around 20 microns, as well as 100 by 100 mm advanced packages with substrate designs containing micron and submicron scale features. The capability is designed for production deployment and uses the same pre-trained model across customers.
“Engineering teams don’t need louder claims about AI. They need physics intelligence they can validate, reproduce, and sign off on,” said Hardik Kabaria, Founder and CEO of Vinci. “Shipping thermo mechanical warpage extends that foundation, connecting real geometry to material behavior, local stress, and global deformation in a fully automated production flow.”
