Testing fast chips is getting harder. A platform lets engineers check all current and future interfaces quickly and accurately with less setup. Find out more.
Data centers and silicon photonics developers face growing pressure to test ever-faster semiconductor interfaces without compromising accuracy or throughput. Existing test solutions can struggle to keep up with the latest high-speed standards, creating bottlenecks in production and design validation.
Teradyne’s UltraPHY 224G for the UltraFLEXplus platform addresses this challenge. Designed for production testing, it delivers high-fidelity signal generation and measurement that matches bench-level performance, ensuring devices meet strict hardware and software requirements. The system supports emerging data rates—up to 224 Gb/s using PAM4 modulation—while remaining compatible with existing standards at 112 Gb/s.
Built with Multilane modules, the platform provides 8 full-duplex differential lanes plus 8 Rx-only lanes per instrument. Its scalable architecture allows multiple instruments on the same UltraFLEXplus platform and seamless adoption of advanced modulation formats as standards evolve. Engineers can test current and next-generation interfaces on a single platform, reducing setup complexity and future-proofing their workflows.
The company claims that the UltraFLEXplus platform gives semiconductor manufacturers and test engineers the flexibility, speed, and accuracy needed to keep pace with next-generation high-speed designs.
Some of the key benefits of the platform include:
- Works with both UltraPHY 224G and 112G on UltraFLEXplus for all PHY testing.
- The same system can use both testers together to cover all speeds.
- Makes test setup and troubleshooting easier with IG-XL software.
- Built from proven lab technology, ready for production with full support.
- Includes DSO, AWG, and BERT for complete PHY testing.
- Handles signals over 50 GHz reliably in production.
“With the introduction of Teradyne UltraPHY 224G, we are extending our portfolio to meet the most demanding next-generation PHY test requirements,” said Roy Chorev, Vice President and General Manager, Compute Test Division, Teradyne. “Customers can be confident that their UltraPHY investments support both today’s and tomorrow’s chiplet-based architectures, advanced packaging, and KGD workflows.”
