A new two-component epoxy system offers high mechanical bonding and efficient heat conduction, addressing thermal challenges in power electronics, LEDs, battery modules, and industrial assemblies.
The system by Amatech, consisting of a resin and hardener pair, is engineered to address the growing thermal management challenges in modern electronics assemblies.Designed for heat-critical environments, the epoxy offers thermally conductive performance exceeding 1 W/m·K, making it suitable for power modules, LED and opto-electronic devices, RF boards, battery packs, and inverter assemblies. Its dual function—mechanical adhesion plus heat dissipation—helps ensure reliability in high-performance modules where both structural integrity and thermal flow are critical.
The epoxy system supports bonding across a range of substrates, including metals, ceramics, and composites, and is adaptable for precise dispensing, gap filling, and structured assembly processes. Being a two-component system, engineers can control cure schedules, pot life, and bonding sequences, offering flexibility over single-component alternatives in complex assemblies. This control is particularly valuable in industrial, automotive, aerospace, and energy-storage electronics where assembly precision and long-term reliability are essential.
Key highlights inlcude:
- Two-component epoxy system for controlled curing and strong bonds
- Thermally conductive (>1 W/m·K) for heat-critical assemblies
- Bonds diverse substrates: metals, ceramics, composites
- Flexible for dispensing, gap filling, and structured assemblies
- Designed for electrical/electronics-grade reliability and durability
- Suitable for power electronics, LEDs, battery packs, industrial modules
The formulation also addresses electrical and electronics-grade requirements, including dielectric stability, thermal cycling resilience, and durability in service environments. Such features position it as a viable solution for applications in power electronics (IGBT, MOSFET, SiC/GaN modules), hybrid aerospace systems, and industrial control modules.
In a competitive landscape that includes high-performance thermally conductive epoxies from global suppliers, this system distinguishes itself through its focus on locally relevant electronics applications, combining mechanical bonding and thermal performance in a single solution. It leverages advanced material design to meet demanding reliability standards while offering an indigenous option for engineers and integrators seeking alternatives to imported adhesives.
The epoxy system is now available for sample requests and initial orders, with further rollouts planned later in the year, including standardized datasheets, qualification kits, and regional technical support. Its introduction underscores the increasing importance of multifunctional adhesives in enabling high-performance, thermally managed electronics in industrial, automotive, and energy domains.
