Are you struggling with MOSFETs running hot and wasting power? Can this single high-current MOSFET help you design high-power circuits easily? Find out!
While building the high-power designs you might have faced a lot of challenges like the MOSFETs used are running very hot due to which the efficiency decreases. So to meet the current demand you might need multiple devices in parallel due to which an increase in the Bill of Material (BoM) is seen. This also increases the risk of uneven current sharing and early device failure. The MMIX1T500N20X4 launched by Littlefuse is built to remove these pain points by delivering 480 A with only 1.99 mΩ RDS(on), giving you a single-device solution that runs cooler, wastes less energy, and removes the hassle of parallel layouts altogether.
The device is built on an isolated Surface-Mount Power Device – X (SMPD-X) package with topside cooling, which directly addresses thermal bottlenecks in dense power stages. By offering up to twice the current rating and significantly lower conduction losses than typical X4-Class MOSFETs, it simplifies thermal design, reduces printed circuit board (PCB) area, and improves long-term reliability.
This makes the MOSFET particularly useful for designers of direct current (DC) load switches, battery energy storage systems, industrial and process power supplies, industrial charging infrastructure, and high-demand mobility platforms such as drones and vertical take-off and landing (VTOL) systems, where every watt of loss and every square millimeter of PCB matters.
Some of the key features and benefits of the MMIX1T500N20X4 includes:
- Can handle 200 V and has very low resistance for less energy loss.
- Can carry high current so fewer MOSFETs are needed in parallel.
- Small SMPD-X package with 2500 V isolation and better heat handling.
- Low gate charge means less power is needed to switch it.
- Topside cooling makes managing heat easier.
“The new devices enable designers to consolidate multiple paralleled low-current devices into a single high-current device, simplifying the design and reducing component count,” said Antonio Quijano, Product Marketing Analyst at Littelfuse. “This enhances system reliability, streamlines gate driver implementation, and increases both power density and PCB area efficiency.”
