The start of mass production for 12-nanometer 12GB and 16GB DRAM marks a shift in mobile, gaming, and AI device performance with increased efficiency.
Samsung Electronics has announced the start of mass production for 12-nanometer-class LPDDR5X DRAM packages in 12GB and 16GB capacities, highlighting the company’s position in the low-power DRAM market. These DRAM packages are suitable for high-performance computing applications such as gaming consoles and computing devices, offering increased speed and efficiency. They also fit the needs of the wearable technology market and the automotive industry, providing necessary support for functionalities of smartwatches, fitness trackers, and vehicles with AI systems. Samsung’s developments respond to demands for memory solutions that are high-density and low-power, supporting the creation of compact, effective devices.
With expertise in chip packaging, Samsung has produced LPDDR5X DRAM packages that improve space efficiency within mobile devices, enhancing airflow and thermal management, crucial for devices with on-device AI.
The new LPDDR5X DRAM packages have a 4-stack structure, are about 9% thinner, and provide roughly 21.2% better heat resistance than previous models, making them as thin as 0.65 millimeters and the thinnest among current 12GB and higher LPDDR DRAM.
Samsung continues to drive the low-power DRAM market by providing these 0.65mm DRAM modules to mobile processor and device manufacturers. In anticipation of increasing demand for compact, high-performance memory solutions, Samsung is developing 6-layer 24GB and 8-layer 32GB modules, which will be the thinnest in their category for future devices.
“Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. “We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”
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