HomeElectronics NewsNew ProductsEvaluation Board For Latest Generation Of USB Power Delivery ICs

Evaluation Board For Latest Generation Of USB Power Delivery ICs

It could be used for retrofitting new functionalities into existing legacy designs or for prototyping new equipment designs

Enabling engineers to quickly implement USB power delivery, here’s presenting the new FT4233HP high-speed USB serial/FIFO evaluation board, which could be used for retrofitting new functionalities into existing legacy designs or for prototyping new equipment designs.

A pair of incorporated Type-C power delivery serves as sink (receiving power) and source (providing power). While the first port does both, the second port serves only as a sink. Both of these ports are able to support the 5V, 9V, 12V, 15V and 20V power delivery object (PDO) profiles – as defined in revision 3.0 of the USB power delivery specification. These profiles may be configured via attachment of external EEPROM memory, with LED indicators signifying which PDO profile is in use.

While the first port offers USB data transmission plus power delivery, the second port only has power delivery capabilities. A power pass-through function is also present, with the input power on the second port being passed to the first port. External control of power delivery policy can be achieved using the onboard I2C interface and the GPIO pins. These allow adjustment of the voltage regulator and the load switch.

The FT4233HP board has 138.5mm x 77mm dimensions and will be available in Q4 2021.


Vinay Prabhakar Minj
Vinay Prabhakar Minj
Vinay Prabhakar Minj is a technology writer and science communication specialist with a Master’s degree in Communication of Science and Innovation (Science Communication). He is a prolific contributor to Electronics For You, where he has authored over 1,000 articles covering electronics, semiconductors, embedded systems, IoT, and emerging technologies. With a strong foundation in science communication, Vinay focuses on translating complex engineering concepts into clear, accessible, and application-oriented content. His work spans topics such as sensor technologies, chip design, wireless systems, and next-generation electronics, making advanced innovations easier to understand for engineers, students, and industry professionals. Through his extensive contributions, he has built a reputation for delivering reliable, well-researched, and practical insights that help readers stay updated with the rapidly evolving electronics ecosystem. His writing bridges the gap between technical depth and real-world usability, supporting both learning and decision-making in the field.

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