With industry-leading power density, optimised thermal performance, and vertical power delivery (VPD), these compact modules enhance efficiency, reduce resistive losses, and support the growing demands of AI workloads.
Infineon Technologies AG has introduced the next generation of high-density power modules to enhance AI and high-performance computing. The new OptiMOS TDM2454xx quad-phase power modules offer industry-leading power density and efficiency, optimising the total cost of ownership (TCO) for AI data center operators.
With high current density, the modules enable accurate vertical power delivery (VPD), reducing resistive losses and enhancing system performance. Traditional horizontal power delivery forces power to travel across semiconductor surfaces, increasing resistance and energy loss. In contrast, VPD shortens the power path, improving efficiency and performance. These modules build on the company’s OptiMOS TDM2254xD and TDM2354xD dual-phase modules, further advancing power density for next-gen compute platforms.
The key features are:
- Compact Power Density: 10x9x5 mm, 280 A peak
- Industry-First Quad-Phase Module: Integrated embedded capacitors in 10x9x5 mm package
- High Current Density: >2.0 A/mm² (thermally managed)
- Optimised for VPD: Footprint designed for efficient tiling
- Proprietary Magnetics: Enables low-profile vertical power delivery
The demand for power-efficient solutions is critical as data centers consume 2% of global electricity, with AI-driven power needs expected to rise 165% by 2030 (IEA). Infineon’s new modules are vital in optimising energy usage while supporting AI workloads’ growing compute performance requirements.
The OptiMOS TDM2454xx integrates the company’s OptiMOS 6 trench technology, chip-embedded packaging, and innovative magnetic design to enhance electrical and thermal performance. The compact 10x9mm² footprint supports module tiling, improving current flow, thermal management, and mechanical stability. With support for up to 280A across four phases and an embedded capacitor layer, these modules deliver unmatched system power density and reliability when combined with Infineon’s XDP controllers.
“We are proud to expand our AI data center solutions with the OptiMOS TDM2454xx VPD modules,” said Rakesh Renganathan, Vice President of Power ICs at Infineon Technologies. “By leveraging our expertise in power devices, packaging technologies, and system design, we deliver high-performance and energy-efficient computing solutions that drive digitalisation and decarbonisation.”
