Transforming energy efficiency in data centers, EV charging, and renewable systems—delivering up to 70 kW per phase, reduced cooling needs, and scalable design for demanding industrial applications.
Infineon Technologies AG has expanded its GaN power portfolio with the launch of the EasyPACK CoolGaN Transistor 650 V module, a high-performance solution designed for high-voltage applications such as AI data centers, renewable energy systems, and DC electric vehicle charging infrastructure.
As global energy demands surge—driven by the rise of artificial intelligence, electric mobility, and industrial digitalization—efficiency and power density are becoming critical. The new module addresses these needs with a compact and scalable design, enabling up to 70 kW per phase from a single module. Built on the trusted Easy Power Module platform, it delivers enhanced ease of use and helps customers reduce design complexity and accelerate time-to-market.
The key features are:
- Delivers up to 70 kW per phase with a single module for compact, scalable high-power systems
- PressFIT cold-welding ensures gas-tight, solder-free joints
- Provides long-term mechanical stability and reliable electrical conductivity
- Designed to perform under harsh thermal and mechanical conditions
The module integrates 650 V CoolGaN semiconductors with low parasitic inductance thanks to compact die packaging. Fast, efficient switching supports high power density and flexible system designs. The company’s .XT interconnect technology, implemented on a high-performance substrate, minimizes thermal resistance—leading to reduced cooling requirements, improved thermal cycling robustness, and greater overall reliability.
The module supports a wide range of circuit topologies and customization options, making it adaptable for various industrial and energy-sector needs. With its focus on performance, scalability, and efficiency, this latest product underlines Infineon’s commitment to enabling the future of energy through advanced power electronics.
“This new addition to our GaN portfolio combines Infineon’s deep expertise in power semiconductors and advanced packaging,” said Roland Ott, Senior Vice President and Head of the Green Energy Modules and Systems Business Unit at Infineon. “It offers a robust, energy-efficient solution tailored to the demands of data centers, green energy, and EV charging applications.”
