The 12A power module offers flexible configuration, system monitoring, protection features, and reduced board space for use in AI, industrial, and data center applications.

As AI at the edge continues to drive greater system integration and power demands, advanced power management solutions are becoming essential for industrial automation and data center applications. Microchip Technology has introduced the MCPF1412, a high-efficiency, fully integrated point-of-load power module delivering 12A with a 16V input buck converter. It also supports I²C and PMBus interfaces.
Engineered for superior performance and reliability, the MCPF1412 ensures efficient power conversion and minimal energy loss. Its compact 5.8 mm × 4.9 mm × 1.6 mm Land Grid Array (LGA) package reduces board space requirements by more than 40% compared to traditional discrete designs. With its small footprint, enhanced reliability, and reduced PCB switching and RF noise, the MCPF1412 stands out as a leading solution in its class.
The MCPF1412M06 offers exceptional configuration flexibility and system monitoring via I²C and PMBus interfaces. It also supports standalone operation without a digital interface, enabling easy output voltage configuration through resistor dividers and basic system monitoring using the Power Good signal.
Key features include comprehensive diagnostics such as over-temperature, over-current, and over-voltage protection, enhancing both performance and reliability. The module operates across a wide junction temperature range of −40°C to +125°C and includes an onboard EEPROM for storing default power-up settings.
Microchip provides a broad portfolio of DC-DC power modules with input voltages ranging from 5.5V to 70V, housed in compact, rugged, and thermally optimized packages for high power density.
“The MCPF1412 is highly compatible with our FPGAs and PCIe® solutions, providing a comprehensive solution for Microchip customers,” said Rudy Jaramillo, vice president of Microchip’s analog power interface division. “This innovative solution minimizes space usage by reducing chip placements when combined with other Microchip devices.”