Can soldering profiles be created without complex machine settings? A software aims to improve consistency while reducing setup effort.
IBL Löttechnik launches its latest software for vapour phase soldering at EFX 2026 in Stuttgart. The new Advanced Process Control (APC) software, together with Automatic Gradient Control (AGC), is designed to simplify profile creation, improve process stability and ensure more consistent soldering results for increasingly complex electronic assemblies.
Instead of requiring users to configure multiple machine parameters manually, APC allows engineers to define the desired soldering profile based on process requirements. The software then calculates and controls the necessary machine settings automatically. According to the company, this reduces setup time, minimises the risk of incorrect parameter selection and enables faster introduction of new PCB assemblies, particularly in low-volume production or applications with frequent product changes.
AGC, integrated within APC, further automates the process by controlling temperature gradients in real time. Users specify the required heating rate in degrees Celsius per second, while the software continuously adjusts machine parameters using live temperature measurements. This closed-loop control helps maintain consistent temperature profiles despite changes in process conditions, reducing variation between production runs and limiting operator influence.
The software also works with IBL’s Advanced Process Monitoring (APM) system, which continuously records process data for monitoring, analysis and traceability. The combination enables manufacturers to detect process deviations early, reduce scrap and maintain documentation required for quality-critical industries such as automotive, aerospace, defence, medical electronics and industrial manufacturing.
“This approach offers considerable advantages, especially for frequently changing products, small batch sizes, or complex assemblies. Users benefit from more intuitive operation, shorter setup times, and significantly higher process stability,” says Olaf Cieply, Global Sales Manager at IBL Löttechnik.
Click here for the official announcement.
