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Tag: surface mount device (SMD)

The new product offering by KEMET in the form of Tantalum Stack Polymer (TSP) capacitors is optimal for high power telecommunication applications The TSP series also offers improved derating conditions and larger capacitance for ensuring low failure rate...
The company's high-density packaging technology enables creation of a surface mount chip for both high-density packaging and high-efficiency applications Delivers thermal stability and mechanical robustness with low-loss KEMET has further strengthened its power conversion solutions by extending its KC-LINK...

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