NFC Applications With Dynamic Message And Anti-Tamper Features

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The new type-5 tags facilitate extended contactless communication and include tamper detection for user privacy

Uniquely combining NFC Type-5 properties with augmented NFC Data Exchange Format (NDEF) and tamper detection are the ST25TV512C and ST25TV02KC tags let developers leverage NFC contactless communication in new and imaginative ways for applications in consumer engagement, brand recognition, supply-chain management and access control. 

The NFC Type-5 tags respond both to smartphones and 13.56MHz long-range RFID readers that allow NDEF message exchanges without a mobile app. Moreover, Augmented NDEF supports dynamically updated information such as tamper status or a personalised URL to be added to NDEF messages. Up to six different attributes can be configured to append to the message including a Unique Tap Code (UTC), which makes messages unique and dynamic at each tap of the tag.

With the added benefit of tamper detection in the ST25TV02KC-T variant, use cases that need to verify the integrity of assets can leverage the enhanced flexibility of Augmented NDEF communication. All devices feature state-of-the-art protection services, which include a 64-bit encrypted password with failed-attempt counter for data safety, TruST25 digital-signature services to verify die authenticity, and untraceable and kill modes to protect user privacy.

Developers working with the ST25TV512C and ST25TV02KC tags can deliver high-quality solutions to market quickly. 

The tags deliver advantages such as extended communication range with superior reliability. Additionally, retaining the same chip capacitance as the previous product generation helps to simplify the design of the antenna. The tags operate from -40 degrees Celsius to 85 degrees Celsius and integrate a configurable EEPROM with 60-year data retention.

The ISO/IEC 15693-compliant ST25TV512C (ST25TV512C-AFG3) and ST25TV02KC (ST25TV02KC-TFG3 & ST25TV02KC-AFG3) are now available from STMicroelectronics as sawn and bumped wafer or packaged in UFDFPN5.


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