Designed for wireless communication, the chips integrate multiprotocol support and efficient wireless management for IoT, smart building and home automation devices.
Silicon Labs announces its Series 3 SoC, the SiMG301 and SiBG301, with 22 nm multi-core design SoC. It separates application, wireless and security tasks to handle larger protocol stacks and heavier compute needs at the edge.
The SiMG301 runs on multiple protocols like Zigbee, Bluetooth Low Energy and Matter over Thread at the same time. It targets connected devices such as lighting, switches, sensors and controllers. Its built-in LED pre-driver lowers external part requirements in line-powered products.
The SiBG301, bluetooth-optimised, focuses on Bluetooth Low Energy designs. Both chips come with up to 4 MB Flash, 512 kB RAM, and the PIXELRZ interface for LED control, enabling efficient dimming in lighting systems.
The multi-protocol SoC SiMG301 The SiMG301 is among the first devices included in the Connectivity Standards Alliance’s new Matter Compliant Platform Certification program. A Matter Compliant Platform is a tested combination of SDK and designated hardware that has been certified by the Alliance for core Matter functionality.
It also allows faster approval through Fast Track and Recertification schemes. Series 2 MG24 and MG26 devices are included in the same programme.
The Series 3 chips introduce Secure Vault, this means the devices are built to withstand advanced hardware tampering attempts and keep data safe over long product lifecycles. The security system also supports secure software updates and lifecycle management, helping manufacturers meet tightening rules such as the EU Radio Equipment Directive, the Cyber Resilience Act and the US Cyber Trust Mark.
