Advanced convection architecture and smart power control aim to raise profiling precision while cutting operating costs in high-mix SMT lines.
A new 16-zone reflow oven configuration by Kurtz Ersa is positioning itself as a high-performance option for electronics manufacturers seeking tighter thermal control and improved process efficiency in surface-mount production. The HOTFLOW THREE platform integrates advanced convection technology with intelligent power management to deliver stable, repeatable soldering results across complex PCB assemblies.
At the core of the system is a Smart Convection Power Unit (SCPU®), engineered to optimize heat transfer while significantly reducing nitrogen consumption. The approach focuses on balancing energy input with airflow precision, helping manufacturers maintain consistent temperature profiles even in demanding, high-density board designs. By refining convection dynamics inside each heating zone, the oven supports uniform heat distribution and minimized thermal deviation from setpoints.
The key features:
- 16 heating zones for precise thermal gradient control
- SCPU convection system for optimized heat transfer
- Reduced nitrogen consumption with stable process atmosphere
- High profiling repeatability for complex PCB assemblies
- Smart factory connectivity and process data integration
The 16-zone configuration is designed to provide extended process flexibility, enabling fine-tuned thermal gradients across long and multilayer boards. This is particularly relevant for automotive, industrial, and high-reliability electronics, where tight process windows and void reduction remain critical quality benchmarks.
Process stability is further supported by enhanced profiling repeatability. The system architecture prioritizes consistent airflow, controlled heat ramp-up, and stable cooling transitions, reducing the risk of component stress or solder defects. In nitrogen-assisted processes, optimized gas management helps lower overall consumption without compromising solder joint integrity.
Connectivity is also built into the platform to align with smart factory environments. The oven supports modern data integration requirements, allowing manufacturers to monitor performance metrics, document process parameters, and integrate reflow operations into broader line management systems.With energy efficiency, profiling accuracy, and nitrogen optimization at the forefront, the 16-zone configuration reflects a broader industry shift toward cost-aware, data-driven thermal processingwithout sacrificing throughput or solder quality.
