By simultaneously reading two sets of coils through a single chip, it streamlines system design, boosts accuracy, and supports the safety and performance demands of next-generation electric and steer-by-wire systems.
Melexis has unveiled the MLX90514, the company’s first application-specific standard product (ASSP) that can read two separate sets of inductive coils simultaneously. The chip is aimed squarely at advanced vehicle systems such as steering torque measurement, steering angle sensing and steer-by-wire architectures, where dual-channel sensing is increasingly critical.
The key features are:
- Reads two coil sets simultaneously for dual-channel sensing
- On-chip differential and vernier angle calculations
- Interfaces: SENT, SPC, PWM, and SPI
- 24-bit SENT/SPC output (two 12-bit synchronized channels)
- Accepts external PWM input for combined torque/angle sensing
- Enables compact coil and PCB layouts
- Supports ASIL D functional safety (SEooC compliant)
It integrates differential and vernier angle calculations on-chip, meaning it can process two channel inputs and compute complex position information internally — reducing the host processing burden and eliminating the need for two separate ICs or discrete magnetic sensors. According to the company, this brings system-level benefits including fewer components in the bill-of-materials, tighter PCB layouts and lower latency in real-time control loops.
Connectivity options include SENT, SPC and PWM interfaces for module-based use, as well as SPI for
embedded applications. The SENT/SPC output is capable of carrying a 24-bit payload, in effect two synchronized 12-bit channels, enabling high-fidelity angle and torque data for demanding automotive use. The device supports integration with external PWM signals, allowing combination of inductive coil inputs with other sensor inputs in a single IC. On the functional safety front, it is designed to enable ASIL D-compliant systems when used as a Safety Element out of Context (SEooC).
By consolidating dual-coil input processing into one sensor IC, it aims to streamline module design, lower complexity and cost, and support tighter packaging in steering drives, motor controls and other motion systems.
