Friday, November 14, 2025

Full Angle 3D AOI For PCB Inspection 

Designed for both high-volume lines and agile production setups, it promises sharper accuracy, faster changeovers, and seamless smart-factory connectivity.

3D AOI For PCB Inspection

Viscom is now stepping up its optical inspection game with a newly highlighted 3D AOI (automatic optical inspection) system that aims to deliver “excellent inspection results from all perspectives”. In today’s electronics manufacturing world—where miniaturization, complex solder joints and dual-sided assemblies are the norm—this system purports to offer a real boost in quality control. 

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At the core of the new solution is a 3D inspection method, which is especially useful for modern PCB works: for example, identifying components with a 3D grid, measuring solder volumes precisely and overcoming reflection or hidden-joint issues caused by body components (chips, etc).  The system uses up to eight angled side-cameras in conjunction with 3D strip‐projection to ensure the image texture is free of lateral inaccuracies and inspection speed is maintained. 

3D AOI For PCB Inspection

The key features and specifications are:

  • Certified, exact 3D measurements of components and solder joints.
  • High inspection speed enabled by advanced optics and camera setup. 
  • Seamless data integration for smart factory environments and production quality control. 
  • Number of angled-view cameras: Up to 8 angled cameras for shadow-free 3D inspection
  • Inspection speed: Up to ~60-65 cm²/s in high-volume models
  • PCB size capacity (handling): Up to 508 mm × 508 mm (20″ × 20″) in standard large board versions

One of the standout features is its “360View” functionality: operators can select the viewing angle and obtain a true-to-life 3D display from nearly all unobstructed viewing angles, aided by the side cameras for reliable defect classification.  From a practical standpoint, it has exact certified 3D measurement, rapid inspection speed, flexible system configurations (for long boards, fast-flow handling or dual-track operation) and integration for smart-factory data exchange. 

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The new 3D AOI suite is designed for both high-volume production as well as more flexible or fast-changeover environments: simple programming, adaptability to new requirements and quick product changeovers are cited as design goals.  Additionally, the company mentions a desktop AOI variant for off‐line or prototype inspection, aimed at medium lot sizes, providing the same angular camera coverage and defect detection reliability for smaller runs. 

For fabs looking to tighten up their inspection loop and handle tougher assemblies (miniaturised components, dual-side boards, hidden joints), this offering appears positioned as both a high-performance and future-proof choice. Users may want to evaluate integration with their data-systems and how the angled-camera architecture fits their footprint—but the specification highlights mark a significant upgrade in the AOI space.

For more information, click here.

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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