Designed for scalable integration, it merges high-efficiency processing with robust connectivity—paving the way for smarter automation, intelligent vision, and connected IoT systems.
iWave has launched a new Open Standard Module (OSM) built around MediaTek’s Genio 1200 SoC, promising modular, scalable compute for AI-embedded systems, edge vision, and industrial IoT. At its core, the Genio 1200 OSM is designed to the OSM v1.2 “Size L” LGA format, delivering a flexible building block for high-performance embedded designs. The module packs a hybrid 8-core CPU arrangement — with quad Cortex-A78 cores and quad Cortex-A55 cores — and pairs them with a Mali-G57 GPU and on-chip NPU/vision accelerator.
The key features are:
- Memory: Supports up to 16 GB LPDDR4X for high-speed performance.
- Storage: Up to 128 GB eMMC with optional expansion via microSD or other interfaces.
- Connectivity: Includes Gigabit Ethernet, multiple USB 3.0/2.0 ports, and PCIe lanes.
- Multimedia Interfaces: Offers MIPI CSI for cameras and MIPI DSI for display integration.
Its design targets industrial and AI-edge use cases: vision processing, smart appliances, robotics, and more. The module is rated for an operating temperature range from –40 °C to +85 °C, making it suitable for rugged deployment scenarios. iWave also offers thermal solutions, enclosures, and board support packages (BSPs) to complement the module.
Because it conforms to the OSM standard, the Genio 1200 SoM allows device makers to swap modules or upgrade SoCs without redesigning the carrier board — a key advantage in long-lifecycle industrial applications.
With this launch, iWave adds yet another powerful modular option for developers seeking a mid-to high end AI/vision capable SoM with open standard compatibility. As edge AI workloads proliferate, such modular building blocks could become the backbone of tomorrow’s smart devices.
