Enhanced 1200 V EconoDUAL 3 Portfolio With IGBT7 Chip

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Offers increased power density and performance for high design flexibility of numerous industrial power applications

With the current classes ranging from 300 A up to 900 A, the new EconoDUAL 3 portfolio by Infineon Technologies comes equipped with TRENCHSTOP IGBT7 chips and delivers increased power density and performance. The device portfolio offers inverter designers a high degree of flexibility for solar, commercial, construction and agricultural vehicles (CAV), uninterruptible power supply (UPS) inverters and drive applications. 

The TRENCHSTOP IGBT7 chip incorporated in the EconoDUAL 3 gives much lower static losses compared to modules with an IGBT4 chipset. Furthermore, the IGBT7 chip helps in reducing the on-state voltage by up to 30 per cent, thus significantly reducing losses, especially for industrial drives, which usually operate at moderate switching frequencies. The switching loss reduction for the 600 A module is up to 24 per cent compared to the former generation, offering a simplified design-in for applications with higher switching frequency. Additionally, all features can be implemented in the same footprint for upgrading the existing inverter system designs. 

The new power modules have an improved oscillation behaviour, thanks to better controllability of the IGBT. Additionally, the power modules feature a maximum overload junction temperature of 175°C. With the extended 750 A and 900 A versions, the EconoDUAL 3 package addresses an improved inverter power range. Also, the PressFIT housing enables a fast and cost-efficient assembly

The 1200 V TRENCHSTOP IGBT7 EconoDUAL 3 portfolio can be ordered now. Variants with pre-applied TIM will also be available soon. 


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